Abstract
Scatterometry is a promising method, capable of providing accurate profile information for a large range of applications. However, applying scatterometry to the production environment and applying it to APC is still difficult. In this paper we propose an alternative approach in which we apply a Neural Network to directly correlate scatterometry raw data and the lithography process control parameters. The proposed method is much easier to use than normal scatterometry, and can therefore be applied to APC much faster.
Original language | English |
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Pages (from-to) | 765-768 |
Number of pages | 4 |
Journal | Proceedings of SPIE - The International Society for Optical Engineering |
Volume | 4689 II |
DOIs | |
State | Published - 2002 |
Externally published | Yes |
Keywords
- Apc
- Lithography
- Neural network
- Process control
- Scatterometry