Copper-catalyzed C-P bond construction via direct coupling of secondary phosphines and phosphites with aryl and vinyl halides

Dmitri Gelman, Lei Jiang, Stephen L. Buchwald*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

289 Scopus citations

Abstract

(Matrix presented) A general method for the coupling of aryl and vinyl halides with diaryl and dialkyl phosphines, as well as with dibutyl phosphite, is reported. This highly efficient transformation is realized through the use of copper(I) iodide as a catalyst, N,N′-dimethylethylenediamine as a ligand, and Cs2CO3 as a base. A variety of sterically hindered and/or functionalized substrates were found to react under these reaction conditions to provide products in good to excellent yields.

Original languageAmerican English
Pages (from-to)2315-2318
Number of pages4
JournalOrganic Letters
Volume5
Issue number13
DOIs
StatePublished - 26 Jun 2003
Externally publishedYes

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