Copper ink-jet inks for flexible and plastic electronics

Michael Grouchko*, Shlomo Magdassi

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

One of the greatest challenges in fabrication of flexible and plastic electronics devices by printing is to obtain highly conductive patterns at sufficiently low temperatures which will not damage the heat sensitive substrates. Therefore, during the last decade, several approaches for the sintering of metallic nanoaprticles (NPs), usually silver, at low temperatures, were developed. However, the high cost of these silver based nano-inks limits fabrication of low cost plastic devices. Therefore, there is an unmet need for a low cost metallic ink with a low sintering temperature. Here we describe the formation and printing of copper based ink-jet inks. Tailoring the nanoparticles stabilization mechanism enabled the formation of a low sintering temperature ink. It is shown that the use of these ink enables the formation of various devises printed on plastic, for example, copper based electroluminescent device and RFID antennas. Furthermore, the presence of anti-oxidation agents enables to achieve highly conductive patterns stable in air for a long time.

Original languageEnglish
Title of host publicationNIP 2012
Subtitle of host publication28th International Conference on Digital Printing Technologies and Digital Fabrication 2012 - Technical Program and Proceedings
Pages461-462
Number of pages2
StatePublished - 2012
Event28th International Conference on Digital Printing Technologies, NIP 2012 and Digital Fabrication 2012 - Quebec City, QC, Canada
Duration: 9 Sep 201213 Sep 2012

Publication series

NameInternational Conference on Digital Printing Technologies

Conference

Conference28th International Conference on Digital Printing Technologies, NIP 2012 and Digital Fabrication 2012
Country/TerritoryCanada
CityQuebec City, QC
Period9/09/1213/09/12

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