Abstract
Based on the compressive thermal fragmentation test and model proposed recently, a transcrystalline phase grown adjacent to the surface of a high modulus carbon fibre embedded in polycarbonate was found to lower the thermal stresses in the fibre. The interfacial shear stress, calculated from the compressive stress profile generated by the model, was lowered in the presence of a transcrystalline layer. It is proposed that the transcrystalline layer reduces the radial stresses acting on the fibre, thereby reducing the friction component of the interfacial bond strength.
Original language | English |
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Pages (from-to) | 197-207 |
Number of pages | 11 |
Journal | Applied Composite Materials |
Volume | 4 |
Issue number | 4 |
DOIs | |
State | Published - 1997 |
Keywords
- Fragmentation
- Interfacial shear strength
- Microcomposites
- Thermal stresses
- Transcrystanninity