Effect of carboxylic acids on conductivity of metallic films formed by inks based on copper@silver core-shell particles

Anna Pajor-Świerzy*, Yousef Farraj, Alexander Kamyshny, Shlomo Magdassi

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

25 Scopus citations

Abstract

Conductive copper inks have attracted much attention as low-cost replacement for the currently used silver inks for printed electronics. The copper inks should be stable to oxidation at all stages of fabrication of conductive patterns: ink formulation and storage, printing, and post-printing treatment. In the present study, air-stable copper-silver core-shell (Cu@Ag) submicron particles were utilized in conductive ink formulations. To improve the conductivity of the resulting Cu@Ag coatings, the effect of various carboxylic acids was evaluated. It was found that all acids led to decreased resistivity after sintering at elevated temperatures, while the lowest value was only 4 times higher than the bulk resistivity at 3 wt% of oleic. The mechanism governing the effect of carboxylic acids is discussed, in view of possible stabilizer exchange and oxide dissolution.

Original languageAmerican English
Pages (from-to)320-327
Number of pages8
JournalColloids and Surfaces A: Physicochemical and Engineering Aspects
Volume522
DOIs
StatePublished - 5 Jun 2017

Bibliographical note

Publisher Copyright:
© 2017 Elsevier B.V.

Keywords

  • Carboxylic acids
  • Conductive properties
  • Copper@silver core shell particles
  • Ink formulation
  • Thermal sintering

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