TY - JOUR
T1 - Effect of carboxylic acids on conductivity of metallic films formed by inks based on copper@silver core-shell particles
AU - Pajor-Świerzy, Anna
AU - Farraj, Yousef
AU - Kamyshny, Alexander
AU - Magdassi, Shlomo
N1 - Publisher Copyright:
© 2017 Elsevier B.V.
PY - 2017/6/5
Y1 - 2017/6/5
N2 - Conductive copper inks have attracted much attention as low-cost replacement for the currently used silver inks for printed electronics. The copper inks should be stable to oxidation at all stages of fabrication of conductive patterns: ink formulation and storage, printing, and post-printing treatment. In the present study, air-stable copper-silver core-shell (Cu@Ag) submicron particles were utilized in conductive ink formulations. To improve the conductivity of the resulting Cu@Ag coatings, the effect of various carboxylic acids was evaluated. It was found that all acids led to decreased resistivity after sintering at elevated temperatures, while the lowest value was only 4 times higher than the bulk resistivity at 3 wt% of oleic. The mechanism governing the effect of carboxylic acids is discussed, in view of possible stabilizer exchange and oxide dissolution.
AB - Conductive copper inks have attracted much attention as low-cost replacement for the currently used silver inks for printed electronics. The copper inks should be stable to oxidation at all stages of fabrication of conductive patterns: ink formulation and storage, printing, and post-printing treatment. In the present study, air-stable copper-silver core-shell (Cu@Ag) submicron particles were utilized in conductive ink formulations. To improve the conductivity of the resulting Cu@Ag coatings, the effect of various carboxylic acids was evaluated. It was found that all acids led to decreased resistivity after sintering at elevated temperatures, while the lowest value was only 4 times higher than the bulk resistivity at 3 wt% of oleic. The mechanism governing the effect of carboxylic acids is discussed, in view of possible stabilizer exchange and oxide dissolution.
KW - Carboxylic acids
KW - Conductive properties
KW - Copper@silver core shell particles
KW - Ink formulation
KW - Thermal sintering
UR - http://www.scopus.com/inward/record.url?scp=85015444039&partnerID=8YFLogxK
U2 - 10.1016/j.colsurfa.2017.03.019
DO - 10.1016/j.colsurfa.2017.03.019
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AN - SCOPUS:85015444039
SN - 0927-7757
VL - 522
SP - 320
EP - 327
JO - Colloids and Surfaces A: Physicochemical and Engineering Aspects
JF - Colloids and Surfaces A: Physicochemical and Engineering Aspects
ER -