Keyphrases
Solute
100%
Cu-Nb
100%
Cu Alloy
100%
Creep Rate
100%
Thermal Creep
100%
Solute Segregation
100%
Molecular Dynamics Simulation
66%
Grain Boundary
66%
Creep
66%
Temperature Effect
33%
Low Temperature
33%
Cu-Fe
33%
High Temperature
33%
Elevated Temperature
33%
Fe-Cu
33%
Simulation Techniques
33%
Accumulated Strain
33%
Nanocrystalline Cu
33%
Load-strain
33%
Monte Carlo Dynamics
33%
Atomic Mobility
33%
Temperature Strain
33%
Chemical Disorder
33%
Nanocrystalline Alloys
33%
Apparent Activation Energy
33%
CuZr
33%
Atomic Volume
33%
Engineering
Creep Rate
100%
Thermal Creep
100%
Creep
66%
Nanocrystalline
66%
Grain Boundaries
66%
Low-Temperature
33%
Energy Engineering
33%
Temperature Dependence
33%
Saturates
33%
Elevated Temperature
33%
Accumulated Strain
33%
Atomic Volume
33%
Simulation Technique
33%
Equilibrate
33%
Apparent Activation Energy
33%
Phase Composition
33%
Computer Simulation
33%
Material Science
Creep
100%
Thermal Creep
100%
Copper Alloy
100%
Grain Boundaries
40%
Activation Energy
20%
Nanocrystalline
20%
Nanocrystalline Alloys
20%
Phase Composition
20%