Electrodeposition of sol-gel films on Al for corrosion protection

Mari Sheffer, Alec Groysman, Daniel Mandler*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

183 Scopus citations

Abstract

Sol-gel films were electrodeposited on aluminum electrodes following the methodology we have developed and is based on applying negative potentials. This increases the pH at the surface, causing acceleration of the polymerization. Our process follows the "two step method", in which the monomer is first hydrolyzed in acidic solution (pH ∼ 4) and only then the negative potential is applied, which consumes protons and releases hydroxyl ions, thus enhancing the condensation. Films made of different monomers, i.e., tetraethoxysilane (TEOS), methyl trimethoxysilane and phenyl trimethoxysilane (PTMOS), were prepared, characterized and examined for their corrosion inhibition properties. Potentiodynamic polarization, electrochemical impedance spectroscopy, optical and scanning electron microscopy as well as atomic force microscopy have been used as a means of film characterization. Hydrophobic and steric silanes, such as PTMOS showed a considerable corrosion inhibition capacity as compared to the capacity exhibited by less hydrophobic and steric derivatives such as TEOS. The difference between the conventional dip-coating method and the electrodeposition approach for depositing sol-gel films was also examined, indicating a clear advantage of the latter.

Original languageEnglish
Pages (from-to)2893-2904
Number of pages12
JournalCorrosion Science
Volume45
Issue number12
DOIs
StatePublished - Dec 2003

Bibliographical note

Funding Information:
This work was supported by the Ministry of Science, Culture and Sports under the strategic research (contract 1095).

Keywords

  • Aluminum
  • Corrosion inhibition
  • Electrodeposition
  • Sol-gel

Fingerprint

Dive into the research topics of 'Electrodeposition of sol-gel films on Al for corrosion protection'. Together they form a unique fingerprint.

Cite this