Electroless Plating with Copper Complex Ink as a Seed

Kai Hwa Chew; Yousef Farraj; Shlomo Magdassi

doi:10.1109/EPTC50525.2020.9315010

Electroless Plating with Copper Complex Ink as a Seed

Kai Hwa Chew, Yousef Farraj, Shlomo Magdassi

Institute of Chemistry

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

1 Scopus citations

Abstract

Electroless or electrolytic deposition processes require the use of a very costly catalyst, usually palladium, as a seed material. Here we present the use of a copper complex as a very efficient replacement for the conventional catalysts, which can be directly printed by various technologies such as screen, gravure, and inkjet, on both 2D and 3D substrates. The copper complex can be reduced to pure copper upon short exposure to low-temperature plasma, by heating under inert atmosphere or via photonic sintering. By combining the complex with electroless plating (EP), a resistivity as low as 2.38.cm

Original language	English
Title of host publication	2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	36-40
Number of pages	5
ISBN (Electronic)	9781728189116
DOIs	https://doi.org/10.1109/EPTC50525.2020.9315010
State	Published - 2 Dec 2020
Event	22nd IEEE Electronics Packaging Technology Conference, EPTC 2020 - Virtual, Singapore, Singapore Duration: 2 Dec 2020 → 4 Dec 2020

Publication series

Name	2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020

Conference

Conference	22nd IEEE Electronics Packaging Technology Conference, EPTC 2020
Country/Territory	Singapore
City	Virtual, Singapore
Period	2/12/20 → 4/12/20

Bibliographical note

Publisher Copyright:
© 2020 IEEE.

Access to Document

10.1109/EPTC50525.2020.9315010

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Chew, K. H., Farraj, Y., & Magdassi, S. (2020). Electroless Plating with Copper Complex Ink as a Seed. In 2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020 (pp. 36-40). Article 9315010 (2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EPTC50525.2020.9315010

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abstract = "Electroless or electrolytic deposition processes require the use of a very costly catalyst, usually palladium, as a seed material. Here we present the use of a copper complex as a very efficient replacement for the conventional catalysts, which can be directly printed by various technologies such as screen, gravure, and inkjet, on both 2D and 3D substrates. The copper complex can be reduced to pure copper upon short exposure to low-temperature plasma, by heating under inert atmosphere or via photonic sintering. By combining the complex with electroless plating (EP), a resistivity as low as 2.38.cm",

author = "Chew, {Kai Hwa} and Yousef Farraj and Shlomo Magdassi",

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Chew, KH, Farraj, Y & Magdassi, S 2020, Electroless Plating with Copper Complex Ink as a Seed. in 2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020., 9315010, 2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020, Institute of Electrical and Electronics Engineers Inc., pp. 36-40, 22nd IEEE Electronics Packaging Technology Conference, EPTC 2020, Virtual, Singapore, Singapore, 2/12/20. https://doi.org/10.1109/EPTC50525.2020.9315010

Electroless Plating with Copper Complex Ink as a Seed. / Chew, Kai Hwa; Farraj, Yousef ; Magdassi, Shlomo.
2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020. Institute of Electrical and Electronics Engineers Inc., 2020. p. 36-40 9315010 (2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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Electroless Plating with Copper Complex Ink as a Seed

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