Improved neuronal adhesion to the surface of electronic device by engulfment of protruding micro-nails fabricated on the chip surface

Micha E. Spira, Dotan Kamber, Ada Dormann, Ariel Cohen, Carmen Bartic, Gustaf Borghs, J. P.M. Langedijk, Shlomo Yitzchaik, Keren Shabthai, Josef Shappir

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

35 Scopus citations

Abstract

One of the major problems in assembling efficient neuro-electronic hybrids systems is the low electrical coupling between the components. This is mainly due to the low resistance, extracellular cleft formed between the cell's plasma membrane and the substrate to which it adhere. This cleft shunts the current generated by the neuron, or the device and thus reduces the signal to noise ratio. To increase the clefts electrical resistance we fabricated gold micronails that protrude from the transistor gate surface. The micronails were functionalized by phagocytosis facilitating peptides. Cultured neurons readily engulf the functionalized micronails forming tight physical contact between the cells and the surface of the device.

Original languageAmerican English
Title of host publicationTRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems
Pages1247-1250
Number of pages4
DOIs
StatePublished - 2007
Event4th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS '07 - Lyon, France
Duration: 10 Jun 200714 Jun 2007

Publication series

NameTRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems

Conference

Conference4th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS '07
Country/TerritoryFrance
CityLyon
Period10/06/0714/06/07

Keywords

  • Adhesion to substrate
  • Cultured neurons
  • Neuro-electronic hybrids
  • Seal resistance

Fingerprint

Dive into the research topics of 'Improved neuronal adhesion to the surface of electronic device by engulfment of protruding micro-nails fabricated on the chip surface'. Together they form a unique fingerprint.

Cite this