Abstract
The development of highly conductive copper patterns on low-cost flexible substrates (PET, PEN, etc.) by inkjet printing is reported. Copper films were obtained from a metallo-organic decomposition (MOD) ink composed of a copper complex and suitable low-viscosity solvents. Upon heating the ink decomposed and was converted into metallic copper under nitrogen as inert atmosphere. Additionally samples were prepared using inkjet technology on various substrates. The required layer thickness for current conduction was assessed by printing on PET and sintering at 150°C in a vacuum oven.
| Original language | American English |
|---|---|
| Title of host publication | NIP 2014 |
| Subtitle of host publication | 30th International Conference on Digital Printing Technologies and Digital Fabrication 2014 |
| Publisher | Society for Imaging Science and Technology |
| Pages | 191-193 |
| Number of pages | 3 |
| ISBN (Electronic) | 9780892083114 |
| State | Published - 2014 |
| Event | 30th International Conference on Digital Printing Technologies and Digital Fabrication 2014, NIP 2014 - Philadelphia, United States Duration: 7 Sep 2014 → 11 Sep 2014 |
Publication series
| Name | International Conference on Digital Printing Technologies |
|---|---|
| Volume | 2014-January |
| ISSN (Print) | 2169-4362 |
| ISSN (Electronic) | 2169-4451 |
Conference
| Conference | 30th International Conference on Digital Printing Technologies and Digital Fabrication 2014, NIP 2014 |
|---|---|
| Country/Territory | United States |
| City | Philadelphia |
| Period | 7/09/14 → 11/09/14 |
Bibliographical note
Publisher Copyright:© 2014 Society for Imaging Science and Technology.