Laser chemical process for clean applications of semiconductor manufacturing: Proc.SPIE

David Yogev; Michael Y. Engel; Shaike Zeid; Izhack Barzilay; Boris Livshits

doi:10.1117/12.387543

Laser chemical process for clean applications of semiconductor manufacturing: Proc.SPIE

David Yogev
, Michael Y. Engel
, Shaike Zeid
, Izhack Barzilay
, Boris Livshits

Institute for Medical Research Israel-Canada (IMRIC)

Research output: Contribution to conference › Paper

Abstract

Cleaning applications in the semiconductor manufacturing industry are tougher to meet as the device dimensions decrease. The uniqueness of Oramir-Laser-Chemical process relies on the mutual combination and effectiveness of laser particle removal mechanisms and laser induced photon- thermal-chemical reaction in the mixture of O₂/O₃/NF₃ gases. The process involves ozone blast wave, photodecomposition of O₃ into O radicals, photo-thermal decomposition of NF₃ into fluorine radicals, thermal effects and thin liquid-chemical ablation enhanced particle removal. Recent results on Bare Si wafers, photomasks, EUV masks and scalpel masks show substantial removal efficiency, up to 100 percent for certain applications.

Original language	American English
Pages	77-88
Number of pages	12
DOIs	https://doi.org/10.1117/12.387543
State	Published - 7 Jun 2000

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This output contributes to the following UN Sustainable Development Goals (SDGs)

SDG 9 Industry, Innovation, and Infrastructure

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10.1117/12.387543

Cite this

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abstract = "Cleaning applications in the semiconductor manufacturing industry are tougher to meet as the device dimensions decrease. The uniqueness of Oramir-Laser-Chemical process relies on the mutual combination and effectiveness of laser particle removal mechanisms and laser induced photon- thermal-chemical reaction in the mixture of O2/O3/NF3 gases. The process involves ozone blast wave, photodecomposition of O3 into O radicals, photo-thermal decomposition of NF3 into fluorine radicals, thermal effects and thin liquid-chemical ablation enhanced particle removal. Recent results on Bare Si wafers, photomasks, EUV masks and scalpel masks show substantial removal efficiency, up to 100 percent for certain applications.",

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AU - Barzilay, Izhack

AU - Livshits, Boris

PY - 2000/6/7

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N2 - Cleaning applications in the semiconductor manufacturing industry are tougher to meet as the device dimensions decrease. The uniqueness of Oramir-Laser-Chemical process relies on the mutual combination and effectiveness of laser particle removal mechanisms and laser induced photon- thermal-chemical reaction in the mixture of O2/O3/NF3 gases. The process involves ozone blast wave, photodecomposition of O3 into O radicals, photo-thermal decomposition of NF3 into fluorine radicals, thermal effects and thin liquid-chemical ablation enhanced particle removal. Recent results on Bare Si wafers, photomasks, EUV masks and scalpel masks show substantial removal efficiency, up to 100 percent for certain applications.

AB - Cleaning applications in the semiconductor manufacturing industry are tougher to meet as the device dimensions decrease. The uniqueness of Oramir-Laser-Chemical process relies on the mutual combination and effectiveness of laser particle removal mechanisms and laser induced photon- thermal-chemical reaction in the mixture of O2/O3/NF3 gases. The process involves ozone blast wave, photodecomposition of O3 into O radicals, photo-thermal decomposition of NF3 into fluorine radicals, thermal effects and thin liquid-chemical ablation enhanced particle removal. Recent results on Bare Si wafers, photomasks, EUV masks and scalpel masks show substantial removal efficiency, up to 100 percent for certain applications.

U2 - 10.1117/12.387543

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ER -

Laser chemical process for clean applications of semiconductor manufacturing: Proc.SPIE

Abstract

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