Microstructure evolution across interfaces of heterogeneous metal systems under ultrasonic impact

Youhong Li*, Yinon Ashkenazy, Robert S. Averback

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Large-scale Molecular Dynamics (MD) studies on heterogeneous, model metal systems subjected to intense shock loading by a flyer plate were carried out. Of interest here is the effect of structural defects on interfacial strength under these extreme conditions. The metal target and flyer were essentially single crystals of Cu, but an interface layer was created by varying the mass of the Cu atoms in part of the sample. Interfacial defects in the form of vacancies, and at different concentrations, were introduced into the interfacial region. In addition to microstructural evolution of damage in this system, the shock induced temperature and pressure changes were also analyzed.

Original languageAmerican English
Title of host publicationStability of Thin Films and Nanostructures
PublisherMaterials Research Society
Pages232-237
Number of pages6
ISBN (Print)1558998063, 9781558998063
DOIs
StatePublished - 2004
Event2004 MRS Fall Meeting - Boston, MA, United States
Duration: 29 Nov 20043 Dec 2004

Publication series

NameMaterials Research Society Symposium Proceedings
Volume854
ISSN (Print)0272-9172

Conference

Conference2004 MRS Fall Meeting
Country/TerritoryUnited States
CityBoston, MA
Period29/11/043/12/04

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