Microstructure evolution across interfaces of heterogeneous metal systems under ultrasonic impact

Youhong Li; Yinon Ashkenazy; Robert S. Averback

doi:10.1557/proc-854-u11.2

Microstructure evolution across interfaces of heterogeneous metal systems under ultrasonic impact

Youhong Li^*, Yinon Ashkenazy, Robert S. Averback

^*Corresponding author for this work

Racah Institute of Physics

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

Large-scale Molecular Dynamics (MD) studies on heterogeneous, model metal systems subjected to intense shock loading by a flyer plate were carried out. Of interest here is the effect of structural defects on interfacial strength under these extreme conditions. The metal target and flyer were essentially single crystals of Cu, but an interface layer was created by varying the mass of the Cu atoms in part of the sample. Interfacial defects in the form of vacancies, and at different concentrations, were introduced into the interfacial region. In addition to microstructural evolution of damage in this system, the shock induced temperature and pressure changes were also analyzed.

Original language	English
Title of host publication	Stability of Thin Films and Nanostructures
Publisher	Materials Research Society
Pages	232-237
Number of pages	6
ISBN (Print)	1558998063, 9781558998063
DOIs	https://doi.org/10.1557/proc-854-u11.2
State	Published - 2004
Event	2004 MRS Fall Meeting - Boston, MA, United States Duration: 29 Nov 2004 → 3 Dec 2004

Publication series

Name	Materials Research Society Symposium Proceedings
Volume	854
ISSN (Print)	0272-9172

Conference

Conference	2004 MRS Fall Meeting
Country/Territory	United States
City	Boston, MA
Period	29/11/04 → 3/12/04

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10.1557/proc-854-u11.2

Cite this

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title = "Microstructure evolution across interfaces of heterogeneous metal systems under ultrasonic impact",

abstract = "Large-scale Molecular Dynamics (MD) studies on heterogeneous, model metal systems subjected to intense shock loading by a flyer plate were carried out. Of interest here is the effect of structural defects on interfacial strength under these extreme conditions. The metal target and flyer were essentially single crystals of Cu, but an interface layer was created by varying the mass of the Cu atoms in part of the sample. Interfacial defects in the form of vacancies, and at different concentrations, were introduced into the interfacial region. In addition to microstructural evolution of damage in this system, the shock induced temperature and pressure changes were also analyzed.",

author = "Youhong Li and Yinon Ashkenazy and Averback, {Robert S.}",

year = "2004",

doi = "10.1557/proc-854-u11.2",

language = "אנגלית",

isbn = "1558998063",

series = "Materials Research Society Symposium Proceedings",

publisher = "Materials Research Society",

pages = "232--237",

booktitle = "Stability of Thin Films and Nanostructures",

address = "ארצות הברית",

note = "2004 MRS Fall Meeting ; Conference date: 29-11-2004 Through 03-12-2004",

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Li, Y, Ashkenazy, Y & Averback, RS 2004, Microstructure evolution across interfaces of heterogeneous metal systems under ultrasonic impact. in Stability of Thin Films and Nanostructures. Materials Research Society Symposium Proceedings, vol. 854, Materials Research Society, pp. 232-237, 2004 MRS Fall Meeting, Boston, MA, United States, 29/11/04. https://doi.org/10.1557/proc-854-u11.2

Microstructure evolution across interfaces of heterogeneous metal systems under ultrasonic impact. / Li, Youhong; Ashkenazy, Yinon; Averback, Robert S.
Stability of Thin Films and Nanostructures. Materials Research Society, 2004. p. 232-237 (Materials Research Society Symposium Proceedings; Vol. 854).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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Microstructure evolution across interfaces of heterogeneous metal systems under ultrasonic impact

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