Abstract
Hydrogenated amorphous silicon surfaces, atomically clean and subsequently oxidized to up to 20 Å oxide thickness, were studied using AES and UPS. The oxidation was made in O2 in the pressure range 10-9 Torr to 5 atm and at 23 and 300°C. The oxidation rate at 23°C was found to be the same as that of crystalline silicon while at 300°C it was appreciably faster. Changes in the d N(E) dE AES Si LVV line shape near 80 eV upon oxidation could be correlated to changes in the silicon-oxygen bonding level observed in UPS. The detailed line shape of the AES Si LVV transition indicates that at 300°C a more homogeneous oxide is produced than at 23°C.
Original language | English |
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Pages (from-to) | 488-500 |
Number of pages | 13 |
Journal | Surface Science |
Volume | 116 |
Issue number | 3 |
DOIs | |
State | Published - 1 May 1982 |
Externally published | Yes |