Abstract
Buffer Layer Assisted Laser Patterning (BLALP) method is presented, for patterning metallic layers on surfaces, using laser desorption of a physisorbed buffer layer, e.g. Xe, CO2 or H2O. This technique is based on the utilization of a low power laser pulse used as the photolithographic printer of a metallic thin film. Using a weakly bound buffer material as the template for laser patterning, led to the development of two complementary procedures, 'positive' and 'negative' BLALP. It is discussed as a potential alternative for standard photo-lithography, promising a cleaner, more cost effective, better resolution and more environmentally friendly procedure.
Original language | English |
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Article number | A-38 |
Pages (from-to) | 128-136 |
Number of pages | 9 |
Journal | Proceedings of SPIE - The International Society for Optical Engineering |
Volume | 5513 |
DOIs | |
State | Published - 2004 |
Event | Physical Chemistry of Interfaces and Nanomaterials III - Denver, CO, United States Duration: 3 Aug 2004 → 6 Aug 2004 |
Keywords
- Buffer layer
- Laser patterning
- LITD
- Lithography