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Potential application of tip-enhanced Raman spectroscopy (TERS) in semiconductor manufacturing

  • P. Y. Hung
  • , Thomas E. O'Loughlin
  • , Aaron Lewis
  • , Rimma Dechter
  • , Martin Samayoa
  • , Sarbajit Banerjee
  • , Erin L. Wood
  • , Angela R. Hight Walker

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

8 Scopus citations

Abstract

Tip-enhanced Raman spectroscopy (TERS), with nanometer spatial resolution, has the capability to monitor chemical composition, strain, and activated dopants and is a promising metrology tool to aid the semiconductor R&D processes. This paper addresses the major challenges which limit the application of TERS from routine measurement: the lack of comparability, reproducibility, calibration, and standardization. To address these issues, we have developed a robust test structure and the ability to generate high-quality tips using a high volume manufacturing (HVM) approach. The qualifying data will be presented.

Original languageEnglish
Title of host publicationMetrology, Inspection, and Process Control for Microlithography XXIX
EditorsMartha I. Sanchez, Jason P. Cain
PublisherSPIE
ISBN (Electronic)9781628415261
DOIs
StatePublished - 2015
Externally publishedYes
Event29th Conference on Metrology, Inspection, and Process Control for Microlithography - San Jose, United States
Duration: 23 Feb 201526 Feb 2015

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume9424
ISSN (Print)0277-786X
ISSN (Electronic)1996-756X

Conference

Conference29th Conference on Metrology, Inspection, and Process Control for Microlithography
Country/TerritoryUnited States
CitySan Jose
Period23/02/1526/02/15

Bibliographical note

Publisher Copyright:
© 2015 SPIE.

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

  1. SDG 9 - Industry, Innovation, and Infrastructure
    SDG 9 Industry, Innovation, and Infrastructure

Keywords

  • TERS
  • Tip enhanced Raman spectroscopy
  • defect metrology
  • strained Si

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