The patterning of various 2D and 3D substrates is accomplished using a a new method, reactive transfer printing, combined with a self-reducing copper precursor. The ink composed of the metal precursor is printed on a donor substrate; during its decomposition, the metal is transferred to an acceptor substrate. This process is demonstrated with copper formate as the precursor, forming a copper pattern with excellent conductivity (50% that of bulk copper).
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© 2014 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.
- conductive materials
- copper formate
- cuprous formate
- printed electronics