Printing a Self-Reducing Copper Precursor on 2D and 3D Objects to Yield Copper Patterns with 50% Copper's Bulk Conductivity

Yitzchak Rosen, Michael Grouchko, Shlomo Magdassi*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

24 Scopus citations

Abstract

The patterning of various 2D and 3D substrates is accomplished using a a new method, reactive transfer printing, combined with a self-reducing copper precursor. The ink composed of the metal precursor is printed on a donor substrate; during its decomposition, the metal is transferred to an acceptor substrate. This process is demonstrated with copper formate as the precursor, forming a copper pattern with excellent conductivity (50% that of bulk copper).

Original languageAmerican English
Article number1400448
JournalAdvanced Materials Interfaces
Volume2
Issue number3
DOIs
StatePublished - 1 Feb 2015

Bibliographical note

Publisher Copyright:
© 2014 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Keywords

  • conductive materials
  • copper formate
  • cuprous formate
  • inks
  • printed electronics

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