Self-Reducing Copper Precursor Inks and Photonic Additive Yield Conductive Patterns under Intense Pulsed Light

Yitzchak S. Rosen, Alexey Yakushenko*, Andreas Offenhäusser, Shlomo Magdassi

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

34 Scopus citations

Abstract

Printing conducting copper interconnections on plastic substrates is of growing interest in the field of printed electronics. Photonic curing of copper inks with intense pulsed light (IPL) is a promising process as it is very fast and thus can be incorporated in roll-to-roll production. We report on using IPL for obtaining conductive patterns from inks composed of submicron particles of copper formate, a copper precursor that has a self-reduction property. Decomposition of copper formate can be performed by IPL and is affected both by the mode of energy application and the properties of the printed precursor layer. The energy application mode was controlled by altering three pulse parameters: duration, intensity, and repetitions at 1 Hz. As the decomposition results from energy transfer via light absorption, carbon nanotubes (CNTs) were added to the ink to increase the absorbance. We show that there is a strict set of IPL parameters necessary to obtain conductive copper patterns. Finally, we show that by adding as little as 0.5 wt % single-wall CNTs to the ink the absorptance was enhanced by about 50% and the threshold energy required to obtain a conductive pattern decreased by ∼25%. These results have major implications for tailoring inks intended for IPL processing.

Original languageAmerican English
Pages (from-to)573-581
Number of pages9
JournalACS Omega
Volume2
Issue number2
DOIs
StatePublished - 28 Feb 2017

Bibliographical note

Publisher Copyright:
© 2017 American Chemical Society.

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