TY - JOUR
T1 - Surface engineering on continuous VO2 thin films to improve thermochromic properties
T2 - Top-down acid etching and bottom-up self-patterning
AU - Wang, Ning
AU - Peh, Yew Keat
AU - Magdassi, Shlomo
AU - Long, Yi
N1 - Publisher Copyright:
© 2017 Elsevier Inc.
PY - 2018/2/15
Y1 - 2018/2/15
N2 - Surface engineering is an effective method to improve the thermochromic performance of VO2. In this paper, an acid-etching top down method was proposed to tailor the VO2 surface morphology from the continuous dense-packed surface to patterned structure, which exhibited the enhanced integrated visible transmittance (Tlum) and the enlarged solar modulating abilities (ΔTsol). Moreover, a self-patterning approach was also illustrated to improve the thermochromic properties. The proposed surface engineering methods represent a facile and cost-effective approach for enhancing thermochromic properties that could promote the application of VO2 thin films in smart windows.
AB - Surface engineering is an effective method to improve the thermochromic performance of VO2. In this paper, an acid-etching top down method was proposed to tailor the VO2 surface morphology from the continuous dense-packed surface to patterned structure, which exhibited the enhanced integrated visible transmittance (Tlum) and the enlarged solar modulating abilities (ΔTsol). Moreover, a self-patterning approach was also illustrated to improve the thermochromic properties. The proposed surface engineering methods represent a facile and cost-effective approach for enhancing thermochromic properties that could promote the application of VO2 thin films in smart windows.
KW - Acid etching: Smart window
KW - Surface engineering
KW - Thermochromic properties
KW - Vanadium dioxide
UR - http://www.scopus.com/inward/record.url?scp=85032436373&partnerID=8YFLogxK
U2 - 10.1016/j.jcis.2017.10.096
DO - 10.1016/j.jcis.2017.10.096
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C2 - 29096114
AN - SCOPUS:85032436373
SN - 0021-9797
VL - 512
SP - 529
EP - 535
JO - Journal of Colloid and Interface Science
JF - Journal of Colloid and Interface Science
ER -