Abstract
The development of printed electronics has gained much attention as an alternative for conventional metal-based electronics, mainly due to the ability to print electronic circuits on plastics and by much cheaper means as compared with conventional microelectronics. Here we report on a single stage formation of a highly corrosion resistance coating with hydrophobic properties on printed-Cu nanoparticles. Our method is based on the synergistic effect of benzotriazole (BTA) as corrosion inhibitor and trimethylsiloxysilicate (TMS) as hydrophobic component. Printed-Cu coated with such TMS/BTA layer exhibited excellent corrosion resistance in 3.5% NaCl solution, reducing the dissolution of Cu into soluble species by one order of magnitude.
Original language | English |
---|---|
Pages (from-to) | 329-336 |
Number of pages | 8 |
Journal | Corrosion Science |
Volume | 143 |
DOIs | |
State | Published - Oct 2018 |
Bibliographical note
Publisher Copyright:© 2018 Elsevier Ltd
Keywords
- Benzotriazole
- Copper
- Corrosion inhibition
- Printed electronics
- Sol-gel