Abstract
Fabrication of devices by printing conductive interconnections on plastic substrates is of growing interest. Currently, silver flakes are wildly used, however the high cost of silver prevents their wide use in many electrical devices. A new two-step process for synthesizing thin copper flakes, and their utilization in conductive inks, is reported. In the first step, sub-micrometer copper particles are formed by thermal decomposition and self-reduction of copper formate. These copper particles are then milled in a wet bead mill that results in their transformation into thin flakes with an average thickness of 48 nm. X-ray diffraction results indicate that the copper particles undergo plastic deformation in a mechanism similar to cold rolling. The effect of various process parameters and type of dispersing agents on the morphology and electrical performance is studied. The ink formulations result in printed patterns with 22% of bulk copper conductivity. The optimal ink is used to print functioning near field communication antennas on polyimide film, which is found to have a high bending durability.
Original language | American English |
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Article number | 1800426 |
Journal | Advanced Materials Technologies |
Volume | 4 |
Issue number | 1 |
DOIs | |
State | Published - Jan 2019 |
Bibliographical note
Funding Information:This research was supported by the Ministry of Science, Technology & Space, Israel, and by the National Research Foundation, Prime Minister’s Office, Singapore, under its Campus for Research Excellence and Technological Enterprise (CREATE) program. The authors would like to thank Atzmon Vakahi and Vladimir Uvarov from the HUJI Nano Center for FIB, and XRD measurements. The authors would also like to thank Alexander Kamyshny for his input on this manuscript.
Funding Information:
This research was supported by the Ministry of Science, Technology & Space, Israel, and by the National Research Foundation, Prime Minister's Office, Singapore, under its Campus for Research Excellence and Technological Enterprise (CREATE) program. The authors would like to thank Atzmon Vakahi and Vladimir Uvarov from the HUJI Nano Center for FIB, and XRD measurements. The authors would also like to thank Alexander Kamyshny for his input on this manuscript.
Publisher Copyright:
© 2018 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim
Keywords
- conductive ink
- copper flakes
- copper formate
- copper ink
- printed electronics